A scientific research team led by KTseal has broken through those stale technologies, and significantly improved the problem of poor bonding between FFKM and aluminum piece.

The bonding is improved and obviously different from the past （Figure 1）

The aluminum alloy has good electrical properties, and FFKM has good plasma and chemical resistance, which can be used in many semiconductor related applications (incl. Slit Valve and FTF LCD of the semiconductor device) and different electronic areas; especially for the motive seals, the aluminum alloy may separate from the rubber without the Bonded technology, the incurred leakage may cause product scrapping in the worst case, but the breakthrough of Bonded-Rubber technology makes the more advanced electronic devices available.

FFKM will be unable to bond with the aluminum piece closely after failure of stale technology（Figure 2）

FFKM is already bonded with the aluminum piece closely after failure of brand new technology of KTseal（Figure 3）

At the very start, the research staff in KTseal found that FFKM will react with the aluminum alloy intensively via the medium, and then form the stable mixture, which can form and bond in the mould effectively and dispersedly.

During subsequent research, a group of researchers from different fields jointly developed the method of how to utilize FFKM single chain and fluorinion exchange level to bond both. After filtering a series of media, they found that the single chains of certain sequence can from a structure around the metal on their own. Due to different electrostatic properties of the mixture depending on the diameter and electronic property, they can be bonded and ordered via the medium exchange level. This technology can also be used to bond KTseal 6270.